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Automotive Electronics(Connectivity)
Product application

Automotive Electronics(Connectivity)

Product design

Layer Count:  12L HDI, 3+6+3


Material:  EM-370(Z)


Array Size: 116 mm x 117 mm


Board Thk:  1.2mm+/-10%


Min Line Width/Spacing: 0.05mm/0.05mm


Min BGA Pitch:  0.35mm


Surface Finish:  ENIG + OSP


Product display
Product stacking